MAX EPC Epoxy Potting Compound 4 Circuit Boards -Slow Curing & Low Exothermic 4 Large Casting, High Thermal Conductivity, Seal, Mask, Waterproof & Insulate Electrical Circuits
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MAX EPC Epoxy Potting Compound 4 Circuit Boards -Slow Curing & Low Exothermic 4 Large Casting, High Thermal Conductivity, Seal, Mask, Waterproof & Insulate Electrical Circuits
MAX EPC A/B is a thermally conductive electronic potting compound designed for large mass potting or encapsulation of printed circuit boards and circuits.
MAX EPC Epoxy Potting Compound 4 Circuit Boards -Slow Curing & Low Exothermic 4 Large Casting, High Thermal Conductivity, Seal, Mask, Waterproof & Insulate Electrical Circuits
Articolo #: 19614901

MAX EPC Epoxy Potting Compound 4 Circuit Boards -Slow Curing & Low Exothermic 4 Large Casting, High Thermal Conductivity, Seal, Mask, Waterproof &

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Articolo #: 19614901

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MAX EPC A/B is a thermally conductive electronic potting compound designed for large mass potting or encapsulation of printed circuit boards and circuits.
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Cosa salta all'occhio

Slow Curing
Allows ample working time for adjustments and precise application, ensuring optimal results without rushing, ideal for intricate projects requiring a careful setup.
High Thermal Conductivity
Enhances heat dissipation in circuit boards, improving performance and longevity by preventing overheating, making it suitable for high-demand electronic applications.
Waterproof Seal
Provides reliable protection against moisture and environmental factors, ensuring durability and operational integrity of electrical components in diverse settings and conditions.

Dettagli del prodotto

Shop MAX EPC Epoxy Potting Compound 4 Circuit Boards -Slow Curing & Low Exothermic 4 Large Casting, High Thermal Conductivity, Seal, Mask, Waterproof & Insulate Electrical Circuits online at a best price in San Marino. B07PMTMKZQ
  • MAX EPC A/B is a room temperature cured epoxy-based electronic potting compound
  • Designed for large mass potting or encapsulation of printed circuit boards & circuits
  • Cures slowly for potting large volumes, up to 40 fluid ounces or 1.2 liters
  • Filled with thermally conductive fillers for faster cooling
  • Electrically non-conductive, provides a permanent barrier against air, moisture, and corrosion
  • High thermal conductivity dissipates heat energy efficiently
Specific Uses For ProductElectrical Circuit Protection, Heat Dissipation, Printed Circuit Boards
Item FormGel, Liquid, Paste
Other Special Features of the ProductElectrical Insulating, For Large Volume Potting, Low Heat Exotherm For Thick Pours, Opaque Black, Thermally Conductive
Container TypeBottle
Viscosity LevelMedium
Full Cure Time48 hours
Water Resistance LevelWaterproof
Tensile Strength9900 psi
Compatible MaterialAcrylic, Ceramic, Glass, Plastic
Item Package Quantity1
Volume44 fluid ounces
Specific Gravity1.57 grams_per_cubic_centimeter
Brand NameThe Epoxy Experts, MAX EPOXY SYSTEMS
ModelMAX EPC A/B 44 Ounce Kit
Unit Count44 Fluid Ounces
ManufacturerPolymer Composites, Inc.
Included ComponentsPART A Resin, PART B Curing Agent
Item Weight5 pounds (2.27 kg)
Part NumberMAXEPC44OZ
Material TypeEpoxy Resin
ColorBlack
BrandThe Epoxy Experts, MAX EPOXY SYSTEMS
MaterialEpoxy Resin
Special FeatureElectrical Insulating, For Large Volume Potting, Low Heat Exotherm For Thick Pours, Opaque Black, Thermally Conductive See more
Country of OriginThis item will be imported from US
Date First AvailableApril 23, 2021

A chi è consigliato?

Suitable For
  • Electronics Hobbyists

    Ideal for home projects needing reliable insulation and protection for circuit boards from moisture and environmental factors.

  • Industrial Applications

    Perfect for sealing and insulating electronics in demanding environments, offering high thermal conductivity and low exothermic properties.

  • Repair Technicians

    Useful for professionals restoring electronic devices, providing strong potting compound for robust protection and reliability.

Not Suitable For
  • Quick Repairs

    Not suitable for urgent fixes as it has a slow curing time, delaying project completion.

DESCRIZIONE DEL PRODOTTO

MAX EPC Epoxy Potting Compound 4 Circuit Boards -Slow Curing & Low Exothermic 4 Large Casting, High Thermal Conductivity, Seal, Mask, Waterproof & Insulate Electrical Circuits

Hai qualche domanda? chatta con noi

Domande e risposte dei clienti

  • Domanda: What is MAX EPC Epoxy Potting Compound primarily used for?

    Risposta: MAX EPC Epoxy Potting Compound is primarily utilized for sealing and insulating electronic components in circuit boards. It provides excellent thermal conductivity and moisture resistance, making it ideal for protecting sensitive electronic parts from environmental factors such as humidity, dust, and mechanical stress. This compound is particularly beneficial in applications such as automotive, industrial, and consumer electronics where high durability is necessary.
  • Domanda: How does the slow curing feature benefit the application of the epoxy?

    Risposta: The slow curing feature of MAX EPC Epoxy Potting Compound allows for better penetration into tight spaces and intricate designs within circuit boards. This extended curing time gives users more flexibility to adjust and place components accurately before the compound hardens. Additionally, it enhances the adhesion properties, ensuring the epoxy bonds effectively with various surfaces, which is crucial for long-term reliability in electrical applications.
  • Domanda: Can MAX EPC Epoxy Potting Compound be used for outdoor applications?

    Risposta: Yes, MAX EPC Epoxy Potting Compound is suitable for outdoor applications due to its waterproof properties. It effectively seals and insulates electrical circuits, protecting them against moisture and environmental elements. Ideal for use in outdoor electronics, such as solar panels and outdoor lighting systems, this potting compound ensures that the underlying components remain safe from the damaging effects of weather.
  • Domanda: What are the advantages of using low exothermic epoxy over standard options?

    Risposta: Using MAX EPC's low exothermic epoxy minimizes heat generation during the curing process. This is important because excessive heat can damage sensitive electronic components. By controlling the exothermic reaction, users can confidently pot delicate circuits without the risk of thermal damage. This characteristic makes it particularly advantageous for applications in densely packed electronic assemblies where heat management is crucial.
  • Domanda: Is the MAX EPC Epoxy Potting Compound suitable for high-temperature environments?

    Risposta: Yes, MAX EPC Epoxy Potting Compound is designed to withstand high-temperature environments. Its high thermal conductivity allows it to dissipate heat effectively, making it suitable for applications in automotive and industrial settings where temperature fluctuations can occur. This compound can provide reliable protection for electrical circuits even in demanding thermal conditions.
  • Domanda: How do I properly mix and apply the MAX EPC Epoxy Potting Compound?

    Risposta: To mix and apply MAX EPC Epoxy Potting Compound, start by measuring the resin and hardener according to the manufacturer's instructions. Mix them thoroughly until a uniform consistency is achieved, ensuring all components are well-blended. Apply the mixture to the circuit board, ensuring complete coverage for optimal sealing and insulation. This method is suitable for both DIY enthusiasts and professional use in electronic manufacturing.
  • Domanda: What are some common applications of MAX EPC Epoxy Potting Compound in electronics?

    Risposta: MAX EPC Epoxy Potting Compound is commonly used in various electronic applications, including potting of sensors, transformers, and circuit boards. Its properties make it ideal for use in automotive electronics, telecommunications, and consumer gadgets where environmental protection and electrical insulation are essential. Users appreciate its versatility as it caters to both high-performance and everyday electronic devices.
  • Domanda: Can this epoxy compound be used for DIY project applications?

    Risposta: Absolutely! MAX EPC Epoxy Potting Compound is perfect for DIY projects involving electronics. Hobbyists can use it to pot and protect homemade circuits or repairs in gadgets. Its user-friendly application and slow curing time allow for ample adjustment and placement, making it accessible for both experienced and novice users looking to enhance the durability of their projects.
  • Domanda: What is the curing time for the MAX EPC Epoxy Potting Compound?

    Risposta: The curing time for MAX EPC Epoxy Potting Compound can vary depending on environmental conditions, but it typically requires several hours to set properly. This slow curing process is advantageous, allowing users to adjust component placements before the epoxy hardens. This time consideration is crucial for users working on intricate electronic assemblies that demand precision.
  • Domanda: Where can I buy MAX EPC Epoxy Potting Compound in San Marino?

    Risposta: You can purchase MAX EPC Epoxy Potting Compound from Ubuy in San Marino. Ubuy provides a reliable platform with a broad selection of electronic materials and components, ensuring you can find exactly what you need for your projects. Their commitment to customer satisfaction also means that you can shop with confidence and convenience.

The Epoxy Experts, MAX EPOXY SYSTEMS Electrically Conductive Adhesives Editorial Review

MAX EPC Epoxy Potting Compound is designed for electrical circuit protection, ensuring effective heat dissipation and insulation for printed circuit boards. This epoxy boasts a medium viscosity and low heat exotherm, making it an ideal choice for thick pours. Users praise its low exothermic properties, stating it generates almost no heat during curing, though they note that the long curing time of 48 hours requires patience. Some users have successfully utilized it in various projects, emphasizing its waterproof nature and electrical insulating capabilities. It's easy to use without requiring a vacuum for air bubble removal, although precise measurement is critical for proper curing.

Recensioni e valutazioni dei clienti

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Vantaggi

  • Low heat generation during curing
  • Waterproof and electrically insulating
  • Ideal for large volume potting
  • Easy to mix without vacuum
  • Suitable for diverse materials

Contro

  • Long cure time may require planning ahead

Affidabilità della piattaforma e fiducia degli acquirenti

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€ 59

Ordina subito e ricevilo entro Sunday, Ottobre 11

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Caratteristiche e benefici

  • Thermally conductive potting compound
  • Electrically and thermally non-conductive after cure
  • Long working time
  • Suitable for high and low voltage insulation
  • Permanent barrier against air, moisture, and corrosive environments
  • Waterproof and suitable for continuous water immersion

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