Dynatron Intel Socket 2011 Vapor Chamber Passive Heatsink for 1U Solution R15
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Dynatron Intel Socket 2011 Vapor Chamber Passive Heatsink for 1U Solution R15
Experience optimal cooling efficiency with our Intel Sandy Bridge EP/EX Processors CPU, designed for high performance in 1U servers.
Dynatron Intel Socket 2011 Vapor Chamber Passive Heatsink for 1U Solution R15
Articolo #: 49382789

Dynatron Intel Socket 2011 Vapor Chamber Passive Heatsink for 1U Solution R15

Articolo #: 49382789

€ 50

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Experience optimal cooling efficiency with our Intel Sandy Bridge EP/EX Processors CPU, designed for high performance in 1U servers.
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Cosa salta all'occhio

Efficient Cooling
The vapor chamber design ensures superior heat dissipation, keeping Intel Socket 2011 processors cool under high loads, enhancing performance and longevity.
1U Form Factor
Designed specifically for 1U server environments, this heatsink fits perfectly in space-constrained setups while maintaining optimum cooling efficiency.
Passive Operation
With no moving parts, the passive design guarantees silent operation, reducing noise in server rooms, making it ideal for performance-sensitive applications.

Dettagli del prodotto

Shop a high-quality Dynatron Intel Socket 2011 Vapor Chamber Heatsink for 1U server solution. Supports up to 150 Watts CPU Power, RoHS Compliant, UL Listed. Shop at Ubuy San Marino
Brand NameDynatron
ManufacturerDynatron
UPC840556097488
Model840556097488
Part Number840556097488
Item Dimensions L x W x H3.54"L x 3.54"W x 1.06"H (9 x 9 x 2.7 cm)
Cooler Heatsink MaterialCopper
BrandDynatron
Product Dimensions (L x W x H)3.54"L x 3.54"W x 1.06"H (9 x 9 x 2.7 cm)

A chi è consigliato?

Suitable For
  • Server Administrators

    Ideal for server administrators needing efficient cooling in tight 1U server spaces while maintaining low noise levels.

  • Data Center Usage

    Suitable for data centers prioritizing reliability and thermal management in compact server setups, minimizing downtime.

  • Overclocking Enthusiasts

    Recommended for users who overclock Intel Socket 2011 CPUs and require enhanced cooling without traditional fans.

Not Suitable For
  • Home Users

    Home users with standard computing needs may find this high-performance heatsink unnecessary and overly complex.

DESCRIZIONE DEL PRODOTTO

Dynatron Intel Socket 2011 Vapor Chamber Passive Heatsink for 1U Solution R15

Hai qualche domanda? chatta con noi

Domande e risposte dei clienti

  • Domanda: What are the benefits of using the Dynatron Intel Socket 2011 Vapor Chamber Passive Heatsink?

    Risposta: The Dynatron Intel Socket 2011 Vapor Chamber Passive Heatsink features advanced thermal management capabilities that efficiently dissipate heat from your CPU. This design includes a vapor chamber that enhances heat transfer, keeping temperatures low even during high-performance tasks. Ideal for server applications in compact 1U chassis, it's particularly beneficial in environments where cooling efficiency is paramount. Users often find that it helps maintain optimal CPU performance, prolonging system longevity during high-load periods.
  • Domanda: Is the Dynatron heatsink compatible with other Intel socket types?

    Risposta: The Dynatron Intel Socket 2011 Vapor Chamber Passive Heatsink is specifically designed for Intel Socket 2011 processors. While it offers exceptional performance in this configuration, it is not compatible with other socket types like LGA 1151 or LGA 1200. For users with different Intel sockets, it is vital to select a heatsink designed for their specific CPU socket to ensure proper fitment and cooling efficiency. Always check socket compatibility before making a purchase.
  • Domanda: How does a vapor chamber heatsink work?

    Risposta: A vapor chamber heatsink operates by using a sealed chamber that contains a small amount of liquid coolant. As the CPU generates heat, this liquid evaporates into vapor, spreading heat across the surface area of the heatsink. This rapid transfer allows the heatsink to dissipate heat more efficiently than traditional heatsinks. Users in high-performance environments, such as data centers or gaming setups, find vapor chambers particularly effective for maintaining low CPU temperatures during intense processing tasks.
  • Domanda: What is the installation process for the Dynatron heatsink?

    Risposta: Installing the Dynatron Intel Socket 2011 Vapor Chamber Passive Heatsink typically involves aligning it with the CPU socket and securing it in place using the provided brackets or screws. It's crucial to clean the CPU surface and apply thermal paste if not pre-applied. The process can be performed in most 1U server chassis setups, and having proper tools handy will make the installation smoother. Ensure everything is tightly secured but avoid overtightening to prevent damage.
  • Domanda: Can the Dynatron heatsink accommodate overclocking?

    Risposta: The Dynatron Intel Socket 2011 Vapor Chamber Passive Heatsink can handle moderate overclocking, thanks to its efficient heat dissipation capabilities. While it is primarily designed for standard thermal performance in compact servers, users have successfully utilized it in overclocked systems within the limits of thermal design. It’s recommended to monitor CPU temperatures closely and ensure adequate airflow around the heatsink to maintain optimal performance during overclocking.
  • Domanda: What makes this heatsink suitable for 1U server solutions?

    Risposta: The Dynatron Intel Socket 2011 Vapor Chamber Passive Heatsink is designed specifically for 1U server solutions, making it an ideal choice for compact server applications. Its low-profile design allows it to fit snugly within tight spaces while providing maximum cooling without the need for fans. This feature is especially beneficial in environments where airflow is restricted or noise is a concern, such as in data centers and office settings.
  • Domanda: What materials are used in the construction of this heatsink?

    Risposta: The Dynatron Intel Socket 2011 Vapor Chamber Passive Heatsink is constructed from high-quality materials, including copper and aluminum. The vapor chamber utilizes copper to conduct heat effectively, while aluminum forms the bulk of the heatsink structure. This combination ensures durability and enhanced thermal performance, making it suitable for continuous operation in various computing environments. Users value this construction for its ability to withstand high temperatures while efficiently managing CPU heat.
  • Domanda: How does this passive heatsink differ from active cooling solutions?

    Risposta: Unlike active cooling solutions, which use fans to increase airflow, the Dynatron Intel Socket 2011 Vapor Chamber Passive Heatsink operates without any moving parts. This results in a quieter operation and reduced risk of mechanical failure. Passive heatsinks are ideal for low-noise environments while still providing adequate cooling for CPUs. Users in silent computing setups, such as home theaters or offices, often prefer this option due to its efficiency and noise-free operation.
  • Domanda: Can I use this heatsink with other cooling methods?

    Risposta: Yes, users can combine the Dynatron Intel Socket 2011 Vapor Chamber Passive Heatsink with additional cooling methods to enhance thermal performance. For instance, using case fans or ensuring proper airflow within the server chassis can help maintain lower temperatures under heavy load. This combination is beneficial for users wanting to maximize performance in high-demand scenarios, such as virtualization or graphical processing, where heat generation is significant.
  • Domanda: Where can I buy the Dynatron Intel Socket 2011 Vapor Chamber Passive Heatsink in San Marino?

    Risposta: You can purchase the Dynatron Intel Socket 2011 Vapor Chamber Passive Heatsink from Ubuy in San Marino. Ubuy offers a reliable platform for finding this specialized cooling solution alongside various other tech products. Their user-friendly interface allows you to quickly search and compare different products, ensuring you make an informed purchase decision for your system cooling needs.

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€ 50

Ordina subito e ricevilo entro Monday, Agosto 31

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Caratteristiche e benefici

  • Optimized for Intel Sandy Bridge EP/EX processors.
  • Supports CPU power up to 150 Watts for peak performance.
  • Constructed with a vapor chamber base and copper stacked fin for superior cooling.
  • Meets UL certification and RoHS compliance for safety and environmental standards.
  • Compact dimensions (90.0 x 90.0 x 27.0 mm) fit neatly in 1U racks.
  • Pre-printed thermal grease (Shin-Etsu G751) ensures easy installation.

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